BroadPak is the leading provider of 2.5D/3D integration
technologies, comprehensive package design and development
services, and innovative total solutions. BroadPak’s
mission is to enable and accelerate the development and
commercialization of green semiconductor products and
BroadPak offers cost-effective ultra-high
performance 2.5D/3D integration and supply chain
ecosystem for mixed process Known Good Die (KGD) and
high performance IPs.
The company leverages its
industry-leading world-class expertise and proven
packaging technologies to create competitive advantage
for its clients. BroadPak supports global clients in
networking, communications, medical, aerospace, defense,
and consumer electronics.