Foundation of Semicondoctor Packaging
Substrate is the foundation of semiconductor packaging.
Substrate design manifests the most critical factor
in chip and system performance. Over the years BroadPak
has designed and delivered some of the most advanced and
lowest cost ultra high performance substrates in the industry for
many of the leading companies.
With process nodes shrinking, substrate design and
performance has become the most critical factor for
successful product development. At these nodes substrate
design becomes an integral part of the silicon design
process and silicon-substrate must be co-designed
simoultaniously as one unit. BroadPak substrate design
process is architected from ground-up for co-design.
At BroadPak substrates are architected with strict
adherence to the principals of signal integrity,
electromagnetic fundamentals, design for manufacturing
(DFM) yield and cost. Substrates are designed for wide
variety of packaging solutions including:
--- --- 2.5D/3D
--- --- Flip Chip
--- --- 3D Wafer Level Packaging
--- --- Cavity Down and Up
--- --- System in Package (SIP)
--- 3D packaging,
Package on Package (POP)
Substrate cost is a significant part of the overall
product cost and literally all parameters such as
substrate size, core structure, layer count, drill count
and design rule influence the end cost.
Substrate material is also directly tied to the end
cost. Substrate materials for Integrated Circuits
packages include silicon, glass, organic laminate, organic
build-up, ceramic and flex circuit materials.
organic build-up substrates for flip chip is dominated
by cost verses performance for high performance devices
such as microprocessors, FPGA's, ASIC's, DSP's,
Graphics, Chip sets and the future growth in wireless
BroadPak package substrate co-design methodology is guaranteed to be
optimized for cost verses performance.