BroadPak Corp.
BroadPak Corp.
        
 
BroadPak Corp.
BroadPak Corp.
BroadPak Corp. BroadPak Corp.
BroadPak Corp.
BroadPak Corp.
BroadPak Corp.
BroadPak Corp.

About Us

BroadPak Corp.
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
BroadPak Corp.
 
BroadPak Corp.
 
 

Customer Testimonials

 
 
 
"NetLogic Microsystems relies on BroadPak for the design and development of package substrates of its 10G/40G/100G high speed PHY/SERDES products. BroadPak has consistently exceeded our expectations by delivering the lowest cost high performance substrates in the industry with extremely fast turnaround."
 
Nader Gamini
Vice President of Manufacturing
NetLogic Microsystems, Inc.
 
 
 
"When it came time to design a cost-effective production-worthy 10.3Gbps BGA substrate for MoSys' Bandwidth Engine product, we turned to BroadPak for their expertise in power/signal integrity and their experience working with multiple assembly houses and design rules sets. We were very impressed with BroadPak's ability to apply state-of-the-art design principles to production substrate design and to quickly identify the right solution."
 
Sanjay Dabral
Chief Technical Officer
MoSys, Inc.
 
 
 
 
 
"As any company in a very competitive consumer market, Trident, wanted to fully utilize the DDR3 memory interface speed up to and beyond 1600 Mpbs in a low cost wire-bonded BGA package. We looked around and selected BroadPak. BroadPak’s excellence in silicon-package co-design methodology and state-of-the-art signal and power integrity expertise, helped us to quickly identify the right solution and enabled us to run our memory interface to its full speed."
 
A. Hadaegh
Director of IP
Trident, Inc.
 
 
 
 
 
BroadPak Corp.
BroadPak Corp.
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BroadPak Corp.
BroadPak Corp.