Founded in 2007,
BroadPak is the leading provider of 2.5D/3D integration
technologies, comprehensive design and development
services, and innovative total solutions. BroadPak’s
mission is to enable and accelerate the development and
commercialization of 2.5D/3D semiconductor products and
IPs.
BroadPak offers cost-effective ultra-high
performance 2.5D/3D integration and supply chain
ecosystem for mixed process Known Good Die (KGD) and
high performance IPs. The company leverages its
industry-leading world-class expertise and proven
packaging technologies to create competitive advantage
for its clients. BroadPak supports global clients in
networking, communications, medical, aerospace, defense,
and consumer electronics.
