Foundation of Semicondoctor Packaging

Substrate is the foundation of semiconductor packaging. Substrate design manifests the most critical factor in chip and system performance. Over the years BroadPak has designed and delivered some of the most advanced and lowest cost ultra high performance substrates in the industry for many of the leading companies.

With process nodes shrinking, substrate design and performance has become the most critical factor for successful product development. At these nodes substrate design becomes an integral part of the silicon design process and silicon-substrate must be co-designed simoultaniously as one unit. BroadPak substrate design process is architected from ground-up for co-design.

At BroadPak substrates are architected with strict adherence to the principals of signal integrity, electromagnetic fundamentals, design for manufacturing (DFM) yield and cost. Substrates are designed for wide variety of packaging solutions including:

---    --- 2.5D/3D Integration

---    --- Flip Chip

---    --- 3D Wafer Level Packaging

---    --- Cavity Down and Up

---    --- System in Package (SIP)

        --- 3D packaging, Package on Package (POP)

Substrate Cost

Substrate cost is a significant part of the overall product cost and literally all parameters such as substrate size, core structure, layer count, drill count and design rule influence the end cost.

Substrate material is also directly tied to the end cost. Substrate materials for Integrated Circuits packages include silicon, glass, organic laminate, organic build-up, ceramic and flex circuit materials.


Demand for organic build-up substrates for flip chip is dominated by cost verses performance for high performance devices such as microprocessors, FPGA's, ASIC's, DSP's, Graphics, Chip sets and the future growth in wireless products.

BroadPak package substrate co-design methodology is guaranteed to be optimized for cost verses performance.