Press Release

BroadPak Introduces Semiconductor Industry's First Tamper-Resistant and Security-Enabled 2.5D/3D Packaging Technology

Providing trusted security and resilient platform to meet the emerging market demand for secure enterprise

San Jose, California, July 9, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies and comprehensive design and development services used to enable and accelerate the development of green electronic systems, today announced the immediate availability of its tamper-resistant and security-enabled 2.5D/3D packaging technology. This new platform provides trusted security and resilience needed for critical 2.5D/3D system integration and prevents hijacking of critical data. This new technology is shifting the paradigm in semiconductor industry and enables chip makers and system companies to develop new generations of secure products.

This breakthrough technology prevents reverse engineering of the 2.5D/3D packages and blocks unauthorized access to confidential data. It leverages BroadPak’s universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production.

A report released in January 2014 by the World Economic Forum in collaboration with McKinsey & Company concluded that delays in adopting cyber security capabilities could result in a US$ 3 trillion loss in economic value by 2020. In addition, the 2.5D/3D market is expected to grow 88% by 2017 according to a report by Yole Development market research firm. Also, semiconductor chips are becoming increasingly susceptible to malicious alteration due to globalization of chip design and manufacturing processes. In response to these industry trends, BroadPak has developed this new technology which enables companies to have access to fully secured and tamper-resistant 2.5D/3D package in high volume manufacturing.

"Rising threat to global electronic security has created an urgent need for fully secured and tamper-resistant electronics infrastructure. Given the breath and magnitude of this security challenge, BroadPak has made a significant investment in developing the next generation of secured 2.5D/3D packaging technologies to serve as a foundation for future semiconductor product development," said Farhang Yazdani, President and CEO of BroadPak. “This breakthrough technology can serve a wide variety of markets such as medical, defense, aerospace, financial, enterprise, etc. This will help to proliferate secured 2.5D/3D products worldwide and would greatly benefit both the industry and the consumers”.

More Information

Customers interested in more information can contact BroadPak at +1 (408) 922-9006, (e-mail: inquiry@broadpak.com).

BroadPak Introduces Semiconductor Industry's First Universally Configurable 2.5D/3D Silicon Interposer Platform that Simultaneously Develops Prototypes and Production-Ready Solutions

 Single Platform Fits All Applications, Eliminates Set-up Time and Tooling Costs, and Cuts Prototype Development Time From 12 Weeks to 10 Days

San Jose, California, January 27, 2014 - BroadPak, the leading provider of 2.5D/3D integration technologies, comprehensive design and development services, and innovative total solutions used to enable and accelerate the development of 2.5D/3D electronic systems, today announced the immediate availability of semiconductor industry's first universally configurable 2.5D/3D silicon interposer platform that can be used simultaneously for prototyping and high-volume production. This new technology enables companies to have access to fully customized 2.5D/3D silicon interposer in just 10 days with option of immediate release to high-volume manufacturing. This accelerates customer’s Time to Market (TTM) and reduces development costs by eliminating the set-up time and tooling costs. In addition, not only the prototype development time for conventional silicon interposer is cut from 12 weeks to 10 days, the resulting prototype solution is robust and fully optimized for immediate release to high-volume manufacturing.

An innovative technology breakthrough by BroadPak has created this new silicon interposer platform which can support the development of diverse new semiconductor products with any chip size, technology node, package size, and netlist. This new interposer platform provides a low-cost path for 2.5D/3D memory and logic integration that has been verified for quality, reliability, and mass production. This configurable solution addresses the industry challenges including lengthy and costly prototype development, performance, integration, and IP development. Also, it eliminates the need for design PDKs and overcomes the reliability and supply chain bottlenecks. The new interposer platform serves a broad spectrum of applications such as power, mixed signal, networking, consumer, microcontroller, and embedded processor-based applications.

"Our customers need and demand a new rapid chip development process that can deliver faster Time to Market, higher performance, and more cost-effective solutions," said Farhang Yazdani, President and CEO of BroadPak. “In response to customer requirements, we developed our latest generation of silicon interposer platform which can be used to integrate any existing or new chip designs. This technology has already been field-tested, proven, and ready for full deployment. In addition, we have created a robust supply chain ecosystem that is flexible and can serve various applications and customer requirement from prototype to high-volume production. This new universal platform will accelerate the launch of 2.5D/3D products across the semiconductor industry".