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Customer Testimonials |
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| "NetLogic Microsystems relies on BroadPak for the design and
development of package substrates of its 10G/40G/100G high speed
PHY/SERDES products. BroadPak has consistently exceeded our
expectations by delivering the lowest cost high performance
substrates in the industry with extremely fast turnaround." |
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Nader Gamini
Vice President of Manufacturing
NetLogic Microsystems, Inc. |
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| "When it came time to
design a cost-effective production-worthy 10.3Gbps BGA substrate
for MoSys' Bandwidth Engine product, we turned to BroadPak for
their expertise in power/signal integrity and their experience
working with multiple assembly houses and design rules sets. We
were very impressed with BroadPak's ability to apply
state-of-the-art design principles to production substrate
design and to quickly identify the right solution." |
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Sanjay
Dabral
Chief Technical Officer
MoSys, Inc. |
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| "As any company in a very
competitive consumer market, Trident, wanted to fully utilize
the DDR3 memory interface speed up to and beyond 1600 Mpbs in a
low cost wire-bonded BGA package. We looked around and
selected BroadPak. BroadPak’s excellence in silicon-package
co-design methodology and state-of-the-art signal and power
integrity expertise, helped us to quickly identify the right
solution and enabled us to run our memory interface to its full
speed." |
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A. Hadaegh
Director of IP
Trident, Inc. |
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